Large Solderless Breadboard 830 - Adhesive Back - Detachable Power Lanes

This is the Large Solderless Breadboard 830 tie-points. The back side has an adhesive pad on it, to stick the breadboard to any flat and clean surface.

The 2 power lanes are detachable, and all parts (main panel and power lanes) are tongued and grooved. This way, you can build your own supersized breadboard.

The Large Solderless Breadboard is 165 x 55 mm x 8.5 mm and can accept solid patch wires with a diameter of 0.3 to 0.8 mm diameter (AWG 20-29).

The maximum current per lane must not exceed 5A, the insulation voltage between the lanes is 300V, and must not be exceeded as well.

Check out the CANADUINO® Breadboard Power Supply and USB-UART Module:

Note: The images are examples. Depending on the factory who made them, they can look slightly different but always have the same size and provide the same number of tie points.