Solderless breadboard 400 Tie Points – Adhesive Back – Detachable Power Lanes
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Solderless breadboard with 400 tie points. The backside has an adhesive pad on it, to stick the breadboard on any surface. The 2 power lanes are detachable, and all parts (main panel and power lanes) are tongued and grooved. This way, you can build your own supersized breadboard (see example pictures).
Each board is 82 x 55 mm x 8.5 mm and can accept solid patch wires with a diameter of 0.3 to 0.8 mm diameter (AWG 20-29). The maximum current per lane must not exceed 5A, the insulation voltage between the lanes is 300V, and must not be exceeded as well.
The shown CANADUINO Breadboard Buddy Module is not included.
Specification: Solderless breadboard 400 Tie Points – Adhesive Back – Detachable Power Lanes